| 000 | 00899nam a2200241 a 4500 | ||
|---|---|---|---|
| 008 | 230215s2021^^^^enka^^^^^^^^^^000^0^eng^^ | ||
| 020 |
_a9781108841214 _qempastado |
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| 035 | _aMX001002186217 | ||
| 040 |
_aDLC _bspa _erda _cDLC _dUNAMX |
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| 050 | 0 |
_aTK7874.53 _bK87 |
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| 082 | 0 | 0 |
_a621.3815 _223 |
| 100 | 1 |
_aKuroda, Tadahiro, _eautor |
|
| 245 | 1 | 0 |
_aWireless interface technologies for 3D IC and module integration / _cTadahiro Kuroda, Wai-Yeung Yip |
| 264 | 1 |
_aCambridge, United Kingdom : _bCambridge University Press, _c[2021] |
|
| 300 |
_axii, 323 páginas : _bilustraciones |
||
| 336 |
_atexto _2rdacontent |
||
| 337 |
_asin medio _2rdamedia |
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| 338 |
_avolumen _2rdacarrier |
||
| 650 | 0 | _aTecnología de circuitos integrados interconectados | |
| 650 | 0 | _aCircuitos integrados tridimensionales | |
| 650 | 0 | _aInterconexiones ópticas | |
| 700 | 1 |
_aYip, Wai-Yeung, _eautor |
|
| 999 |
_c68704 _d68704 |
||