TY  - BOOK
AU  - Balde, John W.,
AU  - Johnson,R.Wayne
AU  - Teng, Robert K. F.,
ED  - Institute of Electrical and Electronics Engineers
TI  - Multichip modules: Systems advantages, major constructions, and materials technologies 
T2  - A volume in the ieee press selected reprint series
SN  - 087942267x
AV  - TK7870.15 M85
PY  - 1991///
CY  - New York
PB  - IEEE
KW  - Encapsulado electrónico
KW  - Encapsulado microelectrónico
ER  -