Multichip modules :  Systems advantages, major constructions, and materials technologies / 
Ed. by r. wayne Johnson, Robert k. f. teng, John w. balde 
 - 603 páginas 
 - A volume in the ieee press selected reprint series .
<br/><br/><label>ISBN: </label>087942267x 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Encapsulado electrónico<br/>Encapsulado microelectrónico
<br/><br/><label>LC Class. No.: </label>TK7870.15  / M85